Inventor
SAUJIT BANDHU
Inventor
SG
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections56%
H05KPrinted circuits33%
Y02PClimate change mitigation technologies in the production or processing of goods11%
PatentTitleYear
12,137,521Multilayer circuit board202411,462,845Connector assembly for solderless mounting to a circuit board202211,355,876Electrical connector for printed circuit boards202211,283,218Electrical connector assembly202211,276,949Shielded connector assembly202211,165,208Electrical contact and connector2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2022Patents assigned to 3M INNOVATIVE PROPERTIES CO (5)· patent assignee history
2021–2024Based in SG· patent location history
2024Patents assigned to 3M INNOVATIVE PROPERTIES COMPANY (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| 3M INNOVATIVE PROPERTIES CO | 5 | 2021–2022 |
| 3M INNOVATIVE PROPERTIES COMPANY | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 6 | 2021–2024 |