Inventor
Shuichi Matsuda
Inventor
Tokyo, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices22%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
Y10TTechnical subjects covered by former us classification10%
A61BDiagnosis5%
A61KPreparations for medical, dental or toiletry purposes5%
A61FFilters implantable into blood vessels2%
G01RMeasuring electric variables2%
G06FElectric digital data processing2%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
PatentTitleYear
10,951,100Winding method for electric motor stator, electric motor stator, and fan electric motor202110,327,860Measurement instrument for joint surgery20199,886,564'Server system, communication system, communication terminal device, program, recording medium, and communication method'20188,246,570'Device for cell transplantation'20127,268,439'Semiconductor device having resin-sealed area on circuit board thereof'20077,084,511'Semiconductor device having resin-sealed area on circuit board thereof'20066,858,230'Process for producing medicinal composition of basic hydrophobic medicinal compound'20056,794,750'Semiconductor device'20046,632,452'Medicinal compositions retarded in the discoloration of phenolic hydroxyl compounds'20036,339,337'Method for inspecting semiconductor chip bonding pads using infrared rays'20025,905,303'Method for manufacturing bump leaded film carrier type semiconductor device'19995,897,337'Process for adhesively bonding a semiconductor chip to a carrier film'19995,759,873'Method of manufacturing chip-size package-type semiconductor device'19985,757,078'Semiconductor device with increased multi-bumps and adhered multilayered insulating films and method for installing same'19985,757,068'Carrier film with peripheral slits'19985,726,489'Film carrier semiconductor device'19985,683,942'Method for manufacturing bump leaded film carrier type semiconductor device'19975,424,932'Multi-output switching power supply having an improved secondary output circuit'19955,322,748'Photomask and a method of manufacturing thereof comprising trapezoidal shaped light blockers covered by a transparent layer'19944,985,319'Process for manufacturing a photomask'19914,957,834'Method for manufacturing photomask'19904,876,164'Process for manufacturing a photomask'19894,792,461'Method of forming a photomask material'19884,783,371'Photomask material'19884,738,907'Process for manufacturing a photomask'19884,717,625'Photomask material'19884,661,426'Process for manufacturing metal silicide photomask'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2021Patents assigned to MITSUBISHI ELECTRIC CORP (10)· patent assignee history
1987–1991Based in Itami, JP· patent location history
1990–1994Based in Hyogo, JP· patent location history
1995–2021Based in Tokyo, JP· patent location history
1997–2002Patents assigned to NEC CORP (8)· patent assignee history
2003–2005Patents assigned to SHIONOGI & CO (2)· patent assignee history
2003–2005Based in Amagasaki, JP· patent location history
2004–2007Patents assigned to NEC ELECTRONICS CORP (3)· patent assignee history
2018Patents assigned to BANKGUARD INC (1)· patent assignee history
2019Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 10 | 1987–2021 |
| NEC CORP | 8 | 1997–2002 |
| NEC ELECTRONICS CORP | 3 | 2004–2007 |
| SHIONOGI & CO | 2 | 2003–2005 |
| BANKGUARD INC | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 12 | 1995–2021 |
| Itami, JP | 7 | 1987–1991 |
| Amagasaki, JP | 2 | 2003–2005 |
| Hyogo, JP | 2 | 1990–1994 |
| Kyoto, JP | 1 | 2019 |