Inventor
Etuo Egashira
Inventor
Yamanashi, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Dprimary
B24DTools for grinding, buffing or sharpening17%
C30BSingle-crystal growth17%
H10DInorganic electric semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
RE040139'Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer'20085,279,992'Method of producing a wafer having a curved notch'19945,230,747'Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer'19934,783,225'Wafer and method of working the same'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–1994Patents assigned to HITACHI LTD (3)· patent assignee history
1988–2008Based in Yamanashi, JP· patent location history
2008Patents assigned to RENESAS TECH CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 3 | 1988–1994 |
| RENESAS TECH CORP | 1 | 2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yamanashi, JP | 4 | 1988–2008 |