Inventor

Sriskantharajah Thirunavukarasu

Inventor
Singapore, SG

Overview

26→
Patents
2016–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
C23CCoating metallic material11%
H01JElectric discharge tubes or discharge lamps9%
B08BCleaning in general3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
B22FWorking metallic powder1%
B25JManipulators1%
C22CAlloys1%
F27BFurnaces, kilns, ovens or retorts in general1%
PatentTitleYear
11,111,583Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity202111,053,590Nozzle for uniform plasma processing202110,978,334Sealing structure for workpiece to substrate bonding in a processing chamber202110,930,542Apparatus for handling various sized substrates202110,903,055Edge ring for bevel polymer reduction202110,847,400Adhesive-less substrate bonding to carrier plate202010,784,134Image based substrate mapper202010,777,442Hybrid substrate carrier202010,607,870Substrate carrier for active/passive bonding and de-bonding of a substrate202010,566,226Multi-cassette carrying case202010,549,324Method and apparatus for backside cleaning of substrates202010,504,762Bridging front opening unified pod (FOUP)201910,465,288Nozzle for uniform plasma processing201910,446,423Next generation warpage measurement system201910,347,516Substrate transfer chamber201910,325,790Methods and apparatus for correcting substrate deformity201910,262,877Apparatus and method for reducing substrate sliding in process chambers201910,154,586Apparatus and method for solid state source array design and fabrication201810,153,187Methods and apparatus for transferring a substrate20189,993,853Method and apparatus for backside cleaning of substrates20189,960,023Methods and apparatus for nodule control in a titanium-tungsten target20189,845,533Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity20179,818,624'Methods and apparatus for correcting substrate deformity'20179,740,111'Electrostatic carrier for handling substrates for processing'20179,595,464'Apparatus and method for reducing substrate sliding in process chambers'20179,478,697'Reusable substrate carrier'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016–2021Patents assigned to APPLIED MATERIALS INC (26)· patent assignee history
2016–2021Based in Singapore, SG· patent location history
2017Patents assigned to ELUMALAI KARTHIK (1)· patent assignee history
2017Patents assigned to LEW JEN SERN (1)· patent assignee history
2017Patents assigned to SUNDARRAJAN ARVIND (1)· patent assignee history
2017Patents assigned to THIRUNAVUKARASU SRISKANTHARAJAH (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC262016–2021
ELUMALAI KARTHIK12017
LEW JEN SERN12017
SUNDARRAJAN ARVIND12017
THIRUNAVUKARASU SRISKANTHARAJAHself12017
Locations
LocationPatentsSpan
Singapore, SG262016–2021