Inventor
Kenneth FLACK
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics22%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts22%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering22%
C09DCoating compositions, e.g. paints, varnishes or lacquers11%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C08LCompositions of macromolecular compounds8%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
PatentTitleYear
12,110,362Three-dimensional printing202411,642,843Three-dimensional printing202311,628,619Three-dimensional printing202311,613,670Three-dimensional printing202311,591,486Three-dimensional printing202311,590,696Three-dimensional printing202311,426,931Three-dimensional printing202211,298,876Three-dimensional printing2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (8)· patent assignee history
2022–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 8 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2022–2024 |