Inventor
Nick Labanok
Inventor
Phoenix, AZ, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems20%
B29CShaping or joining of plastics10%
B29LIndexing scheme associated with subclass b29c, relating to particular articles10%
G02BOptical elements, systems or apparatus10%
PatentTitleYear
11,022,792Coupling a magnet with a MEMS device202110,125,013Microelectromechanical system with spring for magnet placement20187,015,073'Method of forming heat spreader with down set leg attachment feature'20066,882,535'Integrated heat spreader with downset edge, and method of making same'20056,756,669'Heat spreader with down set leg attachment feature'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2021Patents assigned to INTEL CORP (5)· patent assignee history
2004–2006Based in Phoenix, AZ, US· patent location history
2018–2021Based in Gilbert, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2004–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 3 | 2004–2006 |
| Gilbert, AZ, US | 2 | 2018–2021 |