Inventor
Paul R. Start
Inventor
Chandler, AZ, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices36%
B29CShaping or joining of plastics7%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application7%
PatentTitleYear
11,049,798Embedded bridge with through-silicon Vias202110,373,893Embedded bridge with through-silicon vias20199,461,014'Methods of forming ultra thin package structures including low temperature solder and structures formed therby'20169,064,971'Methods of forming ultra thin package structures including low temperature solder and structures formed therby'20158,866,290'Molded heat spreaders'20148,703,536'In-situ foam material as integrated heat spreader (IHS) sealant'20148,508,040'In-situ foam materials as integrated heat spreader (IHS) sealant'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2021Patents assigned to INTEL CORP (7)· patent assignee history
2013–2014Patents assigned to MANEPALLI RAHUL N (2)· patent assignee history
2013–2014Patents assigned to START PAUL R (2)· patent assignee history
2013–2021Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2013–2021 |
| MANEPALLI RAHUL N | 2 | 2013–2014 |
| START PAUL Rself | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 7 | 2013–2021 |