Inventor
Tarek A. IBRAHIM
Inventor
US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01LSemiconductor devices27%
G02BOptical elements, systems or apparatus16%
H01FMagnets7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10DInorganic electric semiconductor devices4%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
H03HImpedance networks, e.g. resonant circuits2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
PatentTitleYear
12,560,771Die first fan-out architecture for electric and optical integration202612,555,714Device, method, and system to provide passivation structures of a magnetic material based inductor202612,546,957Photonic integrated circuit packaging architectures202612,541,067Substrate cavity with stepped walls202612,523,826Photonic integrated circuit to glass substrate alignment through integrated cylindrical lens and waveguide structure202612,512,396Flexible die to floor planning with bump pitch scale through glass core via pitch202512,504,581Photonic interconnect and components in glass202512,439,826Integrated MEMS resonator and method202512,422,615Nested glass packaging architecture for hybrid electrical and optical communication devices202512,381,029Stepped coax MIL PTHS for modulating inductance within a package202512,345,932Die last and waveguide last architecture for silicon photonic packaging202512,345,931Optical circuit with optical port in sidewall202512,334,453Soldered metallic reservoirs for enhanced transient and steady-state thermal performance202512,327,797Microelectronic structures including glass cores202512,249,584Microelectronic assemblies having integrated magnetic core inductors202512,230,564Package substrate z-disaggregation with liquid metal interconnects202512,181,710Photonic integrated circuit packaging architecture202412,176,292Microelectronic component having molded regions with through-mold vias202412,068,172Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages202411,923,307Microelectronic structures including bridges202411,817,390Microelectronic component having molded regions with through-mold vias202311,640,942Microelectronic component having molded regions with through-mold vias202311,302,643Microelectronic component having molded regions with through-mold vias2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (23)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 23 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 23 | 2022–2026 |