Inventor
Hisao Ohshima
Inventor
Kawaguchi, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections46%
H05KPrinted circuits38%
G01RMeasuring electric variables8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
PatentTitleYear
7,494,387'Electric contact and socket for electrical part'20096,824,411'Socket for electrical parts'20046,428,337'Socket for electrical parts'20026,280,218'Socket for electrical parts'20016,042,409'Socket for electrical parts'20005,908,324'Socket for electric parts'19995,807,127'Electric connecting apparatus'19985,315,153'Packages for semiconductor integrated circuit'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2009Patents assigned to ENPLAS CORP (8)· patent assignee history
1994Patents assigned to TOYO ALUMINIUM KK (1)· patent assignee history
1994Based in Okegawa, JP· patent location history
1998–2004Based in Kawaguchi, JP· patent location history
1999Based in Kitamoto, JP· patent location history
2009Based in Saitama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ENPLAS CORP | 8 | 1994–2009 |
| TOYO ALUMINIUM KK | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawaguchi, JP | 5 | 1998–2004 |
| Saitama, JP | 1 | 2009 |
| Kitamoto, JP | 1 | 1999 |
| Okegawa, JP | 1 | 1994 |