Inventor
TAKASHI KANEMURA
Inventor
JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Nprimary
H10NElectric solid-state devices not otherwise provided for17%
G06FElectric digital data processing13%
H01LSemiconductor devices13%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure8%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers8%
A61BDiagnosis4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
C08LCompositions of macromolecular compounds4%
C30BSingle-crystal growth4%
PatentTitleYear
12,414,475Piezoelectric film having a vinylidenefluoride/tetrafluoroethylene copolymer film202512,188,151Silicon carbide wafer and method for manufacturing the same202511,793,083Vibration sensor and piezoelectric element202311,476,402Circuit and method for detecting pressure signal with signal due to pyroelectricity in piezoelectric material being suppressed202211,424,402Bimorph-type piezoelectric film2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to DAIKIN IND LTD (4)· patent assignee history
2022–2025Based in JP· patent location history
2023Patents assigned to UNIV OSAKA (1)· patent assignee history
2025Patents assigned to DENSO CORP (1)· patent assignee history
2025Patents assigned to MIRISE Technologies Corporation (1)· patent assignee history
2025Patents assigned to TOYOTA MOTOR CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DAIKIN IND LTD | 4 | 2022–2025 |
| DENSO CORP | 1 | 2025 |
| MIRISE Technologies Corporation | 1 | 2025 |
| TOYOTA MOTOR CO LTD | 1 | 2025 |
| UNIV OSAKA | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2022–2025 |