Inventor
John P. Hummel
Inventor
Millbrook, NY, US
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10NElectric solid-state devices not otherwise provided for10%
H10BElectronic memory devices7%
H10DInorganic electric semiconductor devices7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B82YSpecific uses or applications of nanostructures3%
G11CStatic stores3%
H01FMagnets3%
H01HElectric switches3%
PatentTitleYear
8,247,905'Formation of vertical devices by electroplating'20127,803,639'Method of forming vertical contacts in integrated circuits'20107,608,538'Formation of vertical devices by electroplating'20097,531,367'Utilizing sidewall spacer features to form magnetic tunnel junctions in an integrated circuit'20097,097,777'Magnetic switching device'20067,087,438'Encapsulation of conductive lines of semiconductor devices'20066,985,384'Spacer integration scheme in MRAM technology'20066,933,204'Method for improved alignment of magnetic tunnel junction elements'20056,743,642'Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology'20046,727,589'Dual damascene flowable oxide insulation structure and metallic barrier'20046,680,500'Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers'20046,593,660'Plasma treatment to enhance inorganic dielectric adhesion to copper'20036,577,011'Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same'20036,551,924'Post metalization chem-mech polishing dielectric etch'20036,479,884'Interim oxidation of silsesquioxane dielectric for dual damascene process'20026,448,176'Dual damascene processing for semiconductor chip interconnects'20026,423,566'Moisture and ion barrier for protection of devices and interconnect structures'20026,348,736'In situ formation of protective layer on silsesquioxane dielectric for dual damascene process'20026,329,280'Interim oxidation of silsesquioxane dielectric for dual damascene process'20016,261,951'Plasma treatment to enhance inorganic dielectric adhesion to copper'20016,255,217'Plasma treatment to enhance inorganic dielectric adhesion to copper'20016,221,780'Dual damascene flowable oxide insulation structure and metallic barrier'20016,184,121'Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same'20016,140,226'Dual damascene processing for semiconductor chip interconnects'20006,130,472'Moisture and ion barrier for protection of devices and interconnect structures'20005,976,710'Low TCE polyimides as improved insulator in multilayer interconnect structures'19995,962,113'Integrated circuit device and process for its manufacture'19995,633,034'Process for forming a circuit assembly'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2012Patents assigned to IBM (28)· patent assignee history
1997–2012Based in Millbrook, NY, US· patent location history
1999–2006Based in Verbank, NY, US· patent location history
2001–2003Based in Milbrook, NY, US· patent location history
2004Patents assigned to INFINEON AG (1)· patent assignee history
2012Patents assigned to DELIGIANNI HARIKLIA (1)· patent assignee history
2012Patents assigned to HUANG QIANG (1)· patent assignee history
2012Patents assigned to HUMMEL JOHN P (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 28 | 1997–2012 |
| DELIGIANNI HARIKLIA | 1 | 2012 |
| HUANG QIANG | 1 | 2012 |
| HUMMEL JOHN Pself | 1 | 2012 |
| INFINEON AG | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Millbrook, New York, US | 22 | 1997–2012 |
| Verbank, New York, US | 4 | 1999–2006 |
| Milbrook, New York, US | 2 | 2001–2003 |