Inventor
Daniel Pantuso
Inventor
Portland, OR, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B29CShaping or joining of plastics5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C03CChemical composition of glasses, glazes or vitreous enamels5%
H05KPrinted circuits5%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
11,056,356Fluid viscosity control during wafer bonding202110,825,752Integrated thermoelectric cooling202010,720,345Wafer to wafer bonding with low wafer distortion202010,707,186Compliant layer for wafer to wafer bonding20209,691,716'Techniques for enhancing fracture resistance of interconnects'20179,343,411'Techniques for enhancing fracture resistance of interconnects'20166,646,340'Thermally coupling electrically decoupling cooling device for integrated circuits'20036,525,419'Thermally coupling electrically decoupling cooling device for integrated circuits'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2021Patents assigned to INTEL CORP (8)· patent assignee history
2003–2021Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2003–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Portland, OR, US | 8 | 2003–2021 |