Inventor
Hideo Aoba
Inventor
Tokyo, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Fprimary
H01FMagnets55%
Y10TTechnical subjects covered by former us classification36%
H05KPrinted circuits9%
PatentTitleYear
6,727,792'Method of manufacturing wire wound electronic component'20046,449,830'Method of manufacturing wire wound electronic component'20026,393,691'Electronic chip component and manufacturing method thereof'20026,198,373'Wire wound electronic component'20016,154,112'Chip inductor'20006,144,280'Wire wound electronic component and method of manufacturing the same'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2004Patents assigned to TAIYO YUDEN KK (6)· patent assignee history
2000–2004Based in Tokyo, JP· patent location history
2000–2002Based in Maebashi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIYO YUDEN KK | 6 | 2000–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 3 | 2000–2004 |
| Maebashi, JP | 3 | 2000–2002 |