Inventor

Mineo Kawamoto

Inventor

Hitachi, JP

Overview

1978–2011

Patent span

Electricity

Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits37%

C23CCoating metallic material12%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices12%

Y10TTechnical subjects covered by former us classification12%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds2%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%

C09JAdhesives2%

PatentTitleYear

8,035,979'Printed wiring board with built-in semiconductor element, and process for producing the same'2011 7,894,200'Printed wiring board with built-in semiconductor element, and process for producing the same'2011 6,306,481'Multilayer circuit board having insulating layer with via-holes'2001 6,190,834'Photosensitive resin composition, and multilayer printed circuit board using the same'2001 5,914,216'Multilayer circuit board and photosensitive resin composition used therefor'1999 5,849,460'Photosensitive resin composition and method for using the same in manufacture of circuit boards'1998 5,712,080'Method for manufacturing printed circuit board'1998 5,476,690'Process for preparing printed circuit board'1995 5,356,698'Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same'1994 5,139,923'Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon'1992 5,028,513'Process for producing printed circuit board'1991 4,876,177'Process for producing printed circuit board'1989 4,865,888'Process for electroless copper plating and apparatus used therefor'1989 4,820,549'Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition'1989 4,632,852'Process for electroless copper plating'1986 4,610,910'Printed circuit board, process for preparing the same and resist ink used therefor'1986 4,604,160'Method for manufacture of printed wiring board'1986 4,457,952'Process for producing printed circuit boards'1984 4,378,384'Process for producing printed circuit board by electroless plating'1983 4,293,592'Method for production of printed circuits by electroless metal plating'1981 4,239,813'Process for forming printed wiring by electroless deposition'1980 4,151,313'Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material'1979 4,099,974'Electroless copper solution'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–2001Patents assigned to HITACHI LTD (20)· patent assignee history

1978–2001Based in Hitachi, JP· patent location history

1991–2001Patents assigned to HITACHI CHEMICAL CO LTD (6)· patent assignee history

2011Patents assigned to NIPPON CMK KK (2)· patent assignee history

2011Patents assigned to RENESAS E JP SEMICONDUCTOR INC (2)· patent assignee history

2011Based in Suntou-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	20	1978–2001
HITACHI CHEMICAL CO LTD	6	1991–2001
NIPPON CMK KK	2	2011
RENESAS E JP SEMICONDUCTOR INC	2	2011

Locations

Location	Patents	Span
Hitachi, JP	21	1978–2001
Suntou-gun, JP	2	2011