Inventor
Amitesh SAHA
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,272,614Integrated circuit packages with solder thermal interface materials with embedded particles202512,166,004Solder thermal interface material (STIM) with dopant202412,062,592Integrated circuit packages with thermal interface materials with different material compositions202411,817,369Lids for integrated circuit packages with solder thermal interface materials202311,670,569Channeled lids for integrated circuit packages202311,551,997Thermal management solutions using self-healing polymeric thermal interface materials2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INTEL CORP (6)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2023–2025 |