Inventor
Bejoy J. Kochuparambil
Inventor
Apex, NC, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits37%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact15%
Y10TTechnical subjects covered by former us classification12%
G06FElectric digital data processing10%
B23PMetal-working not otherwise provided for5%
F25BRefrigeration machines, plants or systems5%
F25DRefrigerators5%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use5%
G11BInformation storage based on relative movement between record carrier and transducer2%
H04MTelephonic communication2%
PatentTitleYear
10,765,041Automatically cooling computer system components for safe servicing202010,362,715Automatically cooling computer system components for safe servicing201910,178,621Automatic notification providing sleep state protection for an unattended computing device201910,141,031Storage system airflow impedance regulator201810,045,463Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader20189,936,607Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader20189,930,806'Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component'20189,930,807'Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader'20189,414,523'Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component'20169,307,674'Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component'20169,185,830'Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system'20159,132,519'Directly connected heat exchanger tube section and coolant-cooled structure'20159,027,360'Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system'20158,913,384'Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)'20148,826,049'Minimizing airflow using preferential memory allocation by prioritizing memory workload allocation to memory banks according to the locations of memory banks within the enclosure'20148,687,364'Directly connected heat exchanger tube section and coolant-cooled structure'20148,649,177'Method of fabricating a cooled electronic system'20148,493,738'Cooled electronic system with thermal spreaders coupling electronics cards to cold rails'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2018Patents assigned to IBM (14)· patent assignee history
2013–2016Patents assigned to KOCHUPARAMBIL BEJOY J (7)· patent assignee history
2013–2016Patents assigned to GRAYBILL DAVID P (6)· patent assignee history
2013–2016Patents assigned to IYENGAR MADHUSUDAN K (6)· patent assignee history
2013–2016Patents assigned to KAMATH VINOD (6)· patent assignee history
2013–2020Based in Apex, NC, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 14 | 2013–2018 |
| KOCHUPARAMBIL BEJOY Jself | 7 | 2013–2016 |
| GRAYBILL DAVID P | 6 | 2013–2016 |
| IYENGAR MADHUSUDAN K | 6 | 2013–2016 |
| KAMATH VINOD | 6 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Apex, NC, US | 18 | 2013–2020 |