Inventor
Soo-jae Park
Inventor
Asan-si, KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H05KPrinted circuits16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
PatentTitleYear
10,770,384Printed circuit board having insulating metal oxide layer covering connection pad202010,586,748Printed circuit board and semiconductor package202010,448,508Printed circuit board and semiconductor package including the same201910,204,869Integrated circuit package including shielding between adjacent chips20199,978,693Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package20189,396,979'Wafer carrier including air filters'20169,368,465'Method of forming bump pad structure having buffer pattern'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2016Based in Seongnam-si, KR· patent location history
2018–2020Based in Asan-si, KR· patent location history
2019Based in Gyeonggi-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Asan-si, KR | 4 | 2018–2020 |
| Seongnam-si, KR | 2 | 2016 |
| Gyeonggi-do, KR | 1 | 2019 |