Inventor
Andrew T. Kim
Inventor
Poughkeepsie, NY, US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices21%
H10DInorganic electric semiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10BElectronic memory devices6%
G01RMeasuring electric variables4%
H01HElectric switches4%
B24BMachines, devices, or processes for grinding or polishing1%
B60LPropulsion of electrically-propelled vehicles1%
B82YSpecific uses or applications of nanostructures1%
PatentTitleYear
10,840,447Fabrication of phase change memory cell in integrated circuit202010,811,353Sub-ground rule e-Fuse structure202010,770,393BEOL thin film resistor202010,741,441Collar formation for chamfer-less and chamfered vias202010,651,083Graded interconnect cap202010,615,112MIM capacitor for improved process defect tolerance202010,468,346Advanced interconnects containing an IMT liner201910,325,862Wafer rigidity with reinforcement structure201910,304,783Wafer reinforcement to reduce wafer curvature201910,262,934Three plate MIM capacitor via integrity verification201910,229,873Three plate MIM capacitor via integrity verification20199,852,999Wafer reinforcement to reduce wafer curvature20179,817,063'Interconnect reliability structures'20179,761,539'Wafer rigidity with reinforcement structure'20179,478,509'Mechanically anchored backside C4 pad'20169,435,852'Integrated circuit (IC) test structure with monitor chain and test wires'20169,431,346'Graphene-metal E-fuse'20169,318,413'Integrated circuit structure with metal cap and methods of fabrication'20169,305,879'E-fuse with hybrid metallization'20168,723,290'Electrical fuse device'20148,384,131'Semiconductor device and methods of forming the same'20138,237,202'Semiconductor devices including dehydrogenated interlayer dielectric layers'20128,198,701'Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same'20128,198,702'Electrical fuse device'20128,013,420'Electrical fuse device'20117,892,966'Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same'20117,888,749'Semiconductor devices having selectively tensile stressed gate electrodes and methods of fabricating the same'20117,867,867'Methods of manufacturing semiconductor devices'20117,811,893'Shallow trench isolation stress adjuster for MOS transistor'20107,638,423'Semiconductor device and method of forming wires of semiconductor device'20097,446,033'Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method'20087,387,960'Dual depth trench termination method for improving Cu-based interconnect integrity'20086,776,688'Real-time polishing pad stiffness-control using magnetically controllable fluid'20046,762,501'Low stress integrated circuit copper interconnect structures'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Patents assigned to TEXAS INSTRUMENTS INC (4)· patent assignee history
2004–2010Based in Plano, TX, US· patent location history
2008–2014Based in Yongin-si, KR· patent location history
2009–2014Patents assigned to SAMSUNG ELECTRONICS CO LTD (10)· patent assignee history
2011–2012Based in Gyeonggi-do, KR· patent location history
2012–2014Patents assigned to KIM ANDREW-TAE (4)· patent assignee history
2016–2020Patents assigned to IBM (13)· patent assignee history
2016–2019Patents assigned to GLOBALFOUNDRIES INC (8)· patent assignee history
2016–2020Based in Poughkeepsie, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 13 | 2016–2020 |
| SAMSUNG ELECTRONICS CO LTD | 10 | 2009–2014 |
| GLOBALFOUNDRIES INC | 8 | 2016–2019 |
| KIM ANDREW-TAEself | 4 | 2012–2014 |
| TEXAS INSTRUMENTS INC | 4 | 2004–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 19 | 2016–2020 |
| Yongin-si, KR | 8 | 2008–2014 |
| Plano, Texas, US | 4 | 2004–2010 |
| Gyeonggi-do, KR | 3 | 2011–2012 |