Inventor

Toshimi Aoyama

Inventor

Kanagawa, JP

Overview

16→

Patents

1977–2001

Patent span

Physics

Primary field (CPC G)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices37%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%

H05KPrinted circuits9%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein6%

G03GElectrography6%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%

Y10TTechnical subjects covered by former us classification6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%

B41NPrinting plates or foils3%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds3%

PatentTitleYear

6,291,133'Photosensitive resin composition and flexographic resin plate'2001 6,010,824'Photosensitive resin composition containing a triazine compound and a pre-sensitized plate using the same, and photosensitive resin composition containing acridine and triazine compounds and a color filter and a pre-sensitized plate using the same'2000 5,645,974'Process for the production of printing plates'1997 5,545,281'Method of bonding circuit boards'1996 5,541,038'Photopolymerizable compositions'1996 5,498,498'Photosensitive resin composition used in a method for forming a light-shielding film'1996 5,368,991'Photosensitive resin composition for use as a light-shielding film which can be used as black matrices'1994 5,318,651'Method of bonding circuit boards'1994 5,185,235'Remover solution for photoresist'1993 5,087,552'Photosensitive resin composition'1992 4,933,260'Water based photopolymerizable resin composition'1990 4,767,642'Method for prevention of resin plate surface sticking'1988 4,557,996'Method for providing a pattern-wise photoresist layer on a substrate plate and a surface-protected substrate plate therefor'1985 4,384,011'Process for producing gravure printing plates'1983 4,209,581'Soluble photosensitive resin composition'1980 4,045,231'Photosensitive resin composition for flexographic printing plates'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–2001Patents assigned to TOKYO OHKA KOGYO CO LTD (14)· patent assignee history

1977–1983Based in Yokohama, JP· patent location history

1983Patents assigned to DAINIPPON PRINTING CO LTD (1)· patent assignee history

1985–1988Patents assigned to PHOTOPOLY OHKA CO LTD (2)· patent assignee history

1985–1997Based in Fujisawa, JP· patent location history

1992–2001Based in Kanagawa, JP· patent location history

1994–1996Patents assigned to NEC CORP (2)· patent assignee history

1996–1997Patents assigned to CIBA GEIGY CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOKYO OHKA KOGYO CO LTD	14	1977–2001
CIBA GEIGY CORP	2	1996–1997
NEC CORP	2	1994–1996
PHOTOPOLY OHKA CO LTD	2	1985–1988
DAINIPPON PRINTING CO LTD	1	1983

Locations

Location	Patents	Span
Kanagawa, JP	7	1992–2001
Fujisawa, JP	6	1985–1997
Yokohama, JP	3	1977–1983