Inventor
Ming-Hsi Liu
Inventor
Chung-Li, TW
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices19%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B60BVehicle wheels8%
H10BElectronic memory devices8%
B60TVehicle brake control systems or parts thereof4%
C22CAlloys4%
C23CCoating metallic material4%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
PatentTitleYear
10,711,330Corrosion-resistant magnesium-aluminum alloys including germanium202010,675,911Vehicle wheel isolator20209,797,036'Method of making corrosion resistant and glossy appearance coating for light metal workpiece'20176,963,140'Transistor having multiple gate pads'20055,923,998'Enlarged align tolerance in buried contact process using sidewall spacer'19995,844,284'Damage free buried contact using salicide technology'19985,843,835'Damage free gate dielectric process during gate electrode plasma etching'19985,804,455'Reduced primary crystalline defect damage in NMOSFETS with an optimized LDD structure'19985,759,919'Method for reducing gate oxide damages during gate electrode plasma etching'19985,705,418'Process for fabricating reduced-thickness high-resistance load resistors in four-transistor SRAM devices'19985,686,338'Process for fabricating high-resistance load resistors using dummy polysilicon in four-transistor SRAM devices'19975,679,607'Method of manufacturing a damage free buried contact using salicide technology'19975,567,270'Process of forming contacts and vias having tapered sidewall'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1999Patents assigned to WINBOND ELECTRONICS CORP (8)· patent assignee history
1997–1999Based in Chung-Li, TW· patent location history
1998Based in Taipei, TW· patent location history
2005Patents assigned to ANALOG POWER INTELLECTUAL PROP (1)· patent assignee history
2005Based in Hong Kong, CN· patent location history
2017–2020Patents assigned to GM GLOBAL TECH OPERATIONS LLC (3)· patent assignee history
2017–2020Based in Shanghai, CN· patent location history
2020Patents assigned to GM GLOBAL TECH OPERATIONS (1)· patent assignee history
2020Based in Pudong, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 8 | 1996–1999 |
| GM GLOBAL TECH OPERATIONS LLC | 3 | 2017–2020 |
| ANALOG POWER INTELLECTUAL PROP | 1 | 2005 |
| GM GLOBAL TECH OPERATIONS | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chung-Li, TW | 7 | 1997–1999 |
| Shanghai, CN | 2 | 2017–2020 |
| Pudong, CN | 1 | 2020 |
| Hong Kong, CN | 1 | 2005 |
| Taipei, TW | 1 | 1998 |