Inventor
J. S. Shiao
Inventor
Hsinchu, TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
6,365,485'DRAM technology of buried plate formation of bottle-shaped deep trench'20026,312,983'Etching method for reducing bit line coupling in a DRAM'20016,187,650'Method for improving global planarization uniformity of a silicon nitride layer used in the formation of trenches by using a sandwich stop layer'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2002Patents assigned to MOSEL VITELIC INC (2)· patent assignee history
2001–2002Patents assigned to PROMOS TECH INC (2)· patent assignee history
2001Patents assigned to INFINEON TECH INC (1)· patent assignee history
2001Patents assigned to PROMOS TECHNOLOGIES INC (1)· patent assignee history
2001–2002Based in Hsinchu, TW· patent location history
2002Patents assigned to SIEMENS AG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOSEL VITELIC INC | 2 | 2001–2002 |
| PROMOS TECH INC | 2 | 2001–2002 |
| INFINEON TECH INC | 1 | 2001 |
| PROMOS TECHNOLOGIES INC | 1 | 2001 |
| SIEMENS AG | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 3 | 2001–2002 |