Inventor
Tohru Kamitamari
Inventor
Hirakata, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material55%
H05KPrinted circuits18%
C25CProcesses for the electrolytic production, recovery or refining of metals9%
C25DProcesses for the electrolytic or electrophoretic production of coatings9%
G01NInvestigating or analysing materials by determining their chemical or physical properties9%
PatentTitleYear
7,988,773'Electroless gold plating bath, electroless gold plating method and electronic parts'20117,985,285'Electroless gold plating bath, electroless gold plating method and electronic parts'20115,910,340'Electroless nickel plating solution and method'19995,294,554'Analysis of tin, lead or tin-lead alloy plating solution'19945,266,103'Bath and method for the electroless plating of tin and tin-lead alloy'19935,248,527'Process for electroless plating tin, lead or tin-lead alloy'19935,234,572'Metal ion replenishment to plating bath'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–1994Patents assigned to UEMURA KOGYO KK (3)· patent assignee history
1993Patents assigned to UYEMURA AND COMPANY LIMITED C (1)· patent assignee history
1993–2011Based in Hirakata, JP· patent location history
1999–2011Patents assigned to UYEMURA C & CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UEMURA KOGYO KK | 3 | 1993–1994 |
| UYEMURA C & CO LTD | 3 | 1999–2011 |
| UYEMURA AND COMPANY LIMITED C | 1 | 1993 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hirakata, JP | 7 | 1993–2011 |