Inventor
Woo Jin Lee
Inventor
Uiwang-si, KR
Overview
Patents· 96 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H01LSemiconductor devices5%
G11CStatic stores4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
C23CCoating metallic material4%
G02BOptical elements, systems or apparatus4%
G06FElectric digital data processing4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds2%
C08LCompositions of macromolecular compounds2%
H03KPulse technique2%
PatentTitleYear
11,097,135Rope type elevating device202110,829,671Adhesive film and display member comprising the same202010,822,493Thermoplastic resin composition and article produced therefrom202010,797,464Wavelength locking structure and method for tunable laser202010,777,777Passivation film deposition method for light-emitting diode202010,745,597Adhesive composition, adhesive film prepared from the same and display member including the same202010,669,450Flexible display device202010,640,624Thermoplastic resin composition and article using the same202010,598,092Turbocharger for vehicle202010,601,056Heat treatment method for membrane electrode assembly for fuel cell202010,494,989Apparatus for improving efficiency of turbocharger engine201910,497,649Integrated circuit device and method of manufacturing the same201910,497,505Magnetic composition and inductor including the same201910,490,337Coil component and method of manufacturing the same201910,461,282Method for depositing protection film of light-emitting element201910,444,374GNSS receiver and mobile system including the same201910,378,106Method of forming insulation film by modified PEALD201910,340,073Coil component and method of manufacturing the same201910,304,734Semiconductor devices and methods of manufacturing the same201910,276,505Integrated circuit device and method of manufacturing the same201910,259,978Adhesive film, optical member including the same, and optical display including the same201910,227,513Adhesive composition, adhesive film prepared from the same and display member including the same201910,206,981Anti-inflammatory peptides and composition comprising the same201910,136,515Flexible printed circuit board201810,062,609Semiconductor devices and methods of manufacturing the same201810,046,538Composite sheet, method for manufacturing same, and display device including same201810,039,811Anti-inflammatory peptides and composition comprising the same201810,012,853Flexible substrate bonding method201810,008,407Methods of manufacturing semiconductor devices including conductive structures20189,817,190'Tunable wavelength filter with embedded metal temperature sensor and its application to external-cavity type tunable wavelength laser'20179,804,428'Composite sheet, substrate for a display element including same, and display device including same'20179,790,364'Thermoplastic resin composition and article comprising the same'20179,793,347'Semiconductor device and method of fabricating the same'20179,784,168'Apparatus for compensating for thermal expansion occurring from exhaust manifold'20179,764,969'Bimetallic catalyst for high nitrate nitrogen reduction and selectivity and manufacturing methods thereof'20179,753,228'Optical transmission and reception connector system'20179,632,567'System on chip method thereof, and device including the same'20179,540,419'Anti-inflammatory peptides and composition comprising the same'20179,527,888'Anti-inflammatory peptides and composition comprising the same'20169,396,988'Methods for fabricating semiconductor devices using liner layers to avoid damage to underlying patterns'20169,374,861'Backlight unit'20169,355,703'Devices, systems and methods with improved refresh address generation'20169,329,710'Touchscreen panel and touchscreen device'20169,291,899'Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same'20169,249,126'Oxetane-cyclic epoxy compound, method of preparing the same, and composite sheet for display substrate including the same'20169,240,582'Battery pack'20169,214,381'Semiconductor device and method of fabricating the same'20159,106,361'Passive wavelength division multiplexing device for automatic wavelength locking and system thereof'20159,054,395'Battery pack'20158,962,747'Resist underlayer composition and process of producing integrated circuit devices using the same'20158,932,964'Method of forming a dielectric layer having an ONO structure using an in-situ process'20158,921,258'Catalyst for selective oxidation of NH3 to N2 and method for preparing the same'20148,917,250'Touch panel'20148,841,218'Resist underlayer composition and process of producing integrated circuit devices using same'20148,758,981'Photoresist underlayer composition and method of manufacturing semiconductor device by using the same'20148,742,801'Buffer circuit for semiconductor device'20148,669,185'Method of tailoring conformality of Si-containing film'20148,557,217'Low temperature process for producing nano-sized titanium dioxide particles'20138,415,259'Method of depositing dielectric film by modified PEALD method'20138,394,466'Method of forming conformal film having si-N bonds on high-aspect ratio pattern'20138,334,219'Method of forming stress-tuned dielectric film having Si-N bonds by modified PEALD'20128,302,828'Cross bar of roof carrier for vehicles'20128,173,554'Method of depositing dielectric film having Si-N bonds by modified peald method'20128,142,862'Method of forming conformal dielectric film having Si-N bonds by PECVD'20128,129,291'Method of depositing dielectric film having Si-N bonds by modified peald method'20128,098,500'Phase shift full bridge converter with reduced current stress'20128,095,180'Mobile terminal'20128,003,174'Method for forming dielectric film using siloxane-silazane mixture'20117,972,980'Method of forming conformal dielectric film having Si-N bonds by PECVD'20117,919,416'Method of forming conformal dielectric film having Si-N bonds by PECVD'20117,842,622'Method of forming highly conformal amorphous carbon layer'20107,830,280'Semiconductor devices, a system including semiconductor devices and methods thereof'20107,751,851'Method for managing schedule in mobile communication terminal'20107,717,628'System package using flexible optical and electrical wiring and signal processing method thereof'20107,707,469'Memory test system including semiconductor memory device suitable for testing an on-die termination, and method thereof'20107,656,742'Circuit and method for sampling valid command using extended valid address window in double pumped address scheme memory device'20107,643,355'Semiconductor memory device and method of inputting/outputting data'20107,622,369'Device isolation technology on semiconductor substrate'20097,541,947'Semiconductor devices, a system including semiconductor devices and methods thereof'20097,515,790'Two-dimensional planar photonic crystal superprism device and method of manufacturing the same'20097,499,341'Output circuit, semiconductor memory device having the same, and method of expanding a valid output data window'20097,478,954'Structure and method for optical connection between optical transmitter and optical receiver'20097,470,623'Method of forming a platinum pattern'20087,463,072'Small swing signal receiver for low power consumption and semiconductor device including the same'20087,460,760'Optical waveguide master and method of manufacturing the same'20087,420,387'Semiconductor device capable of controlling OCD and ODT circuits and control method used by the semiconductor device'20087,394,720'Circuit and method for sampling valid command using extended valid address window in double pumped address scheme memory device'20087,391,238'Semiconductor memory device having pre-emphasis signal generator'20087,205,799'Input buffer having a stabilized operating point and an associated method'20077,031,584'Method for manufacturing optical waveguide using laser direct writing method and optical waveguide manufactured by using the same'20067,015,739'Integrated circuit devices having duty cycle correction circuits that receive control signals over first and second separate paths and methods of operating the same'20066,987,407'Delay locked loops having delay time compensation and methods for compensating for delay time of the delay locked loops'20066,797,624'Solution for ruthenium chemical mechanical planarization'20046,440,288'Method for preparing anode electrode for high voltage electrolytic capacitor'20025,972,305'Direct manufacturing method of hydrogen peroxide'19995,714,708'Missile restraining apparatus'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2020Based in Seoul, KR· patent location history
2006–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (32)· patent assignee history
2008–2019Based in Seongnam-si, KR· patent location history
2009–2014Patents assigned to ASM JAPAN (11)· patent assignee history
2009–2014Based in Tama, JP· patent location history
2012–2016Patents assigned to LEE WOO-JIN (11)· patent assignee history
2012–2019Patents assigned to LEE WOO JIN (10)· patent assignee history
2014–2020Based in Uiwang-si, KR· patent location history
2015–2020Patents assigned to SAMSUNG SDI CO LTD (11)· patent assignee history
2016–2020Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 32 | 2006–2020 |
| ASM JAPAN | 11 | 2009–2014 |
| LEE WOO-JINself | 11 | 2012–2016 |
| SAMSUNG SDI CO LTD | 11 | 2015–2020 |
| LEE WOO JINself | 10 | 2012–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Uiwang-si, KR | 12 | 2014–2020 |
| Tama, JP | 11 | 2009–2014 |
| Seoul, KR | 10 | 1999–2020 |
| Suwon-si, KR | 9 | 2016–2020 |
| Seongnam-si, KR | 9 | 2008–2019 |