Inventor
Taejun JEON
Inventor
KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01GCapacitors7%
H05KPrinted circuits7%
H10BElectronic memory devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
12,550,739Semiconductor package including a metal plate and package-on-package having the same202612,463,126Semiconductor package202512,400,970Semiconductor package including electromagnetic shield structure202512,308,253Molded product for semiconductor strip and method of manufacturing semiconductor package202512,205,925Semiconductor package having package substrate2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (5)· patent assignee history
2025–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 5 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 5 | 2025–2026 |