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Inventor

Manabu Tsujimura

Inventor
Yokohama, JP

Overview

57→
Patents
1990–2014
Patent span
Performing operations
Primary field (CPC B)

Patents· 57 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
B08BCleaning in general8%
F24FAir-conditioning7%
H03MCoding5%
H04NPictorial communication, e.g. television5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
C01BNon-metallic elements3%
PatentTitleYear
8,784,262'Vehicular power transmission control apparatus'20148,583,336'Power transmission control apparatus for vehicle'20138,257,143'Method and apparatus for polishing object'20127,895,990'Fuel injection system with injection characteristic learning function'20117,891,337'Fuel injection system with injection characteristic learning function'20117,650,226'Fuel injection system with learning control to compensate for actual-to-target injection quantity'20107,599,784'Fuel injection system learning average of injection quantities for correcting injection characteristic of fuel injector'20097,588,671'Microfluidic treatment method and device'20097,387,717'Method of performing electrolytic treatment on a conductive layer of a substrate'20087,361,076'Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus'20087,234,999'Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus'20077,207,864'Polishing apparatus'20077,198,552'Polishing apparatus'20077,150,673'Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus'20067,101,255'Polishing apparatus'20067,040,968'Polishing apparatus'20066,997,782'Polishing apparatus and a method of polishing and cleaning and drying a wafer'20066,966,821'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'2005RE038878'Polishing apparatus'20056,939,208'Polishing apparatus'20056,936,302'Electroless Ni-B plating liquid, electronic device and method for manufacturing the same'20056,929,722'Substrate plating apparatus'20056,918,814'Polishing apparatus'20056,843,706'Polishing apparatus'20056,783,427'Polishing system with air exhaust system'20046,706,422'Electroless NiB plating liquid, electronic device and method for manufacturing the same'20046,632,335'Plating apparatus'20036,626,736'Polishing apparatus'20036,547,638'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'20036,500,051'Polishing apparatus and method'20026,443,808'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'20026,439,971'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'20026,435,949'Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof'20026,425,806'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'20026,413,146'Polishing apparatus'20026,406,364'Polishing solution feeder'20026,332,826'Polishing apparatus'20016,294,059'Substrate plating apparatus'20016,273,802'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'2001RE036610'Evacuation apparatus and evacuation method'20005,885,138'Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device'19995,868,866'Method of and apparatus for cleaning workpiece'19995,794,114'Ozonizer'19985,792,326'Method and apparatus for generating ozone and methods of its use'19985,746,581'Method and apparatus for evacuating vacuum system'19985,705,230'Method for filling small holes or covering small recesses in the surface of substrates'19985,704,827'Polishing apparatus including cloth cartridge connected to turntable'19985,702,673'Ozone generating apparatus'19975,679,059'Polishing aparatus and method'19975,656,542'Method for manufacturing wiring in groove'19975,632,868'Method and apparatus for generating ozone and methods of its use'19975,500,559'Semiconductor device and method for manufacturing the same'19965,476,414'Polishing apparatus'19955,236,562'Method for discharging hydrogen from a vacuum vessel using a roughing vacuum pump and a turbo-molecular pump'19935,062,271'Evacuation apparatus and evacuation method'19914,926,648'Turbomolecular pump and method of operating the same'19904,906,257'Method of and apparatus for treating waste gas from semiconductor manufacturing process'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–2012Patents assigned to EBARA CORP (47)· patent assignee history
1990–2008Based in Kanagawa, JP· patent location history
1991–2008Patents assigned to TOSHIBA KK (22)· patent assignee history
1993–2012Based in Tokyo, JP· patent location history
1996–2007Based in Yokohama, JP· patent location history
2009–2011Patents assigned to DENSO CORP (4)· patent assignee history
2009–2013Based in Anjo, JP· patent location history
2012–2014Patents assigned to TSUJIMURA MANABU (3)· patent assignee history
2013–2014Patents assigned to AISIN AI CO LTD (2)· patent assignee history
2014Based in Nishio, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP471990–2012
TOSHIBA KK221991–2008
DENSO CORP42009–2011
TSUJIMURA MANABUself32012–2014
AISIN AI CO LTD22013–2014
Locations
LocationPatentsSpan
Yokohama, JP221996–2007
Kanagawa, JP171990–2008
Tokyo, JP121993–2012
Anjo, JP52009–2013
Nishio, JP12014