Inventor
Jason Goodelle
Inventor
San Jose, CA, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
B81BMicrostructural devices or systems, e.g. micromechanical devices11%
H03HImpedance networks, e.g. resonant circuits11%
G06KGraphical data reading8%
G06VImage or video recognition or understanding8%
H01LSemiconductor devices8%
H02NElectric machines not otherwise provided for6%
H10NElectric solid-state devices not otherwise provided for6%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers5%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
PatentTitleYear
10,921,855Interposer for a display driver integrated circuit chip202110,796,128Optical sensor with ambient light filter202010,503,955Device with improved circuit positioning201910,185,866Optical fingerprint sensor package201910,147,757Image sensor structures for fingerprint sensing201810,055,637Optical sensor with substrate light filter20189,048,811'Integration of piezoelectric materials with substrates'20159,030,080'Microelectromechanical systems (MEMS) resonators and related apparatus and methods'20158,698,376'Microelectromechanical systems (MEMS) resonators and related apparatus and methods'20148,587,183'Microelectromechanical systems (MEMS) resonators and related apparatus and methods'20138,541,851'MEMS package'20138,476,809'Microelectromechanical systems (MEMS) resonators and related apparatus and methods'20138,466,606'Integration of piezoelectric materials with substrates'20138,203,190'MEMS device including a chip carrier'20127,763,488'Method of fabricating MEMS device'20107,314,781'Device packages having stable wirebonds'20086,894,400'Robust electronic device packages'20056,890,445'Process for packaging electronic devices using thin bonding regions'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005Based in Kutztown, PA, US· patent location history
2008Based in Allentown, PA, US· patent location history
2010–2013Based in McKees Rocks, PA, US· patent location history
2013–2015Patents assigned to SAND 9 INC (6)· patent assignee history
2013–2015Patents assigned to CHEN DAVID M (5)· patent assignee history
2013–2015Patents assigned to GOODELLE JASON (5)· patent assignee history
2013–2015Patents assigned to KUYPERS JAN H (5)· patent assignee history
2013–2015Based in Boston, MA, US· patent location history
2018–2021Patents assigned to SYNAPTICS INC (5)· patent assignee history
2018–2021Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAND 9 INC | 6 | 2013–2015 |
| CHEN DAVID M | 5 | 2013–2015 |
| GOODELLE JASONself | 5 | 2013–2015 |
| KUYPERS JAN H | 5 | 2013–2015 |
| SYNAPTICS INC | 5 | 2018–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 6 | 2018–2021 |
| Boston, Massachusetts, US | 6 | 2013–2015 |
| McKees Rocks, Pennsylvania, US | 3 | 2010–2013 |
| Allentown, Pennsylvania, US | 1 | 2008 |
| Kutztown, Pennsylvania, US | 1 | 2005 |