Inventor
KAI-MING CHIANG
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
PatentTitleYear
12,512,384Semiconductor package with electrically conductive structure and manufacturing method thereof202512,512,419Method of fabricating memory device and package structure202512,438,007Staggered metal mesh on backside of device die and method forming same202512,334,424Package structure and manufacturing method thereof202512,218,082Package structure202511,855,006Memory device, package structure and fabricating method thereof2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2023–2025 |