Inventor
Eiichi Morisaki
Inventor
Nagoya, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification27%
B23BTurning20%
H05KPrinted circuits13%
H10DInorganic electric semiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
PatentTitleYear
8,125,090'Semiconductor power module'20128,004,075'Semiconductor power module including epoxy resin coating'20115,901,967'Changeable chuck system'19995,158,307'Chuck for machine tools'19925,033,183'Chuck jaw changer for a machine tool'19914,431,201'Chuck with centrifugal compensation device'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984–1999Patents assigned to HOWA MACHINERY LTD (4)· patent assignee history
1984–1999Based in Nagoya, JP· patent location history
2011–2012Patents assigned to HITACHI LTD (2)· patent assignee history
2011–2012Based in Kasama, JP· patent location history
2012Patents assigned to KAWASE DAISUKE (1)· patent assignee history
2012Patents assigned to MORISAKI EIICHI (1)· patent assignee history
2012Patents assigned to SAITO KATSUAKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HOWA MACHINERY LTD | 4 | 1984–1999 |
| HITACHI LTD | 2 | 2011–2012 |
| KAWASE DAISUKE | 1 | 2012 |
| MORISAKI EIICHIself | 1 | 2012 |
| SAITO KATSUAKI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagoya, JP | 4 | 1984–1999 |
| Kasama, JP | 2 | 2011–2012 |