Inventor
Mitsunari Sukekawa
Inventor
Tokyo, JP
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices22%
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10DInorganic electric semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
G11CStatic stores7%
H01FMagnets3%
H10NElectric solid-state devices not otherwise provided for3%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
PatentTitleYear
11,062,989Assemblies which include wordlines over gate electrodes202111,049,864Apparatuses including capacitor structures, and related memory devices, electronic systems, and methods202111,037,940Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memory202111,031,374Methods of compensating for misalignment of bonded semiconductor wafers202110,910,379Integrated assemblies comprising memory cells and shielding material between the memory cells, and methods of forming integrated assemblies202110,867,837Methods of forming integrated circuitry202010,868,078Methods of forming integrated circuitry202010,861,787Memory device with bitline noise suppressing scheme202010,818,665Array of recessed access devices and an array of memory cells individually comprising a capacitor and a transistor202010,600,772Semiconductor memory device having plural chips connected by hybrid bonding method202010,546,811Assemblies which include wordlines over gate electrodes202010,535,710Methods of forming integrated circuitry202010,504,961Methods of forming integrated circuitry201910,410,912Integrated circuitry201910,340,261Semiconductor memory device having plural chips connected by hybrid bonding method201910,103,053Methods of forming integrated circuitry20189,666,573'Methods of forming integrated circuitry'20179,362,288'Semiconductor device and manufacturing method thereof'20169,245,893'Semiconductor constructions having grooves dividing active regions'20168,941,162'Semiconductor device, method for forming the same, and data processing system'20158,541,316'Method of manufacturing semiconductor device including sequentially forming first and second mask material layers and forming a dotted photoresist pattern on the second mask material layer'20138,383,511'Method for manufacturing mask'20138,138,094'Method for manufacturing mask'20128,093,642'Semiconductor memory device and method of manufacturing the same'20127,741,682'Semiconductor integrated circuit device including a silicon layer formed on a diffusion layer'20106,544,840'Semiconductor memory device and manufacturing method and mask data preparing method for the same'20036,469,337'Semiconductor memory device and manufacturing method and mask data preparing method for the same'20026,309,960'Method of fabricating a semiconductor device'20016,261,949'Method for manufacturing semiconductor device'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2003Patents assigned to NEC CORP (4)· patent assignee history
2001–2021Based in Tokyo, JP· patent location history
2010–2013Patents assigned to ELPIDA MEMORY INC (5)· patent assignee history
2012–2015Patents assigned to SUKEKAWA MITSUNARI (5)· patent assignee history
2012–2013Based in Chuo-ku, JP· patent location history
2015–2016Patents assigned to PS4 LUXCO SARL (2)· patent assignee history
2016–2021Patents assigned to MICRON TECHNOLOGY INC (18)· patent assignee history
2017–2021Based in Higashihiroshima, JP· patent location history
2018–2021Based in Hiroshima, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 18 | 2016–2021 |
| ELPIDA MEMORY INC | 5 | 2010–2013 |
| SUKEKAWA MITSUNARIself | 5 | 2012–2015 |
| NEC CORP | 4 | 2001–2003 |
| PS4 LUXCO SARL | 2 | 2015–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 11 | 2001–2021 |
| Hiroshima, JP | 11 | 2018–2021 |
| Higashihiroshima, JP | 5 | 2017–2021 |
| Chuo-ku, JP | 2 | 2012–2013 |