Inventor

Charles C. Garretson

Inventor
Sunnyvale, CA, US

Overview

27→
Patents
2001–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing53%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
Y10TTechnical subjects covered by former us classification16%
H01LSemiconductor devices4%
B24DTools for grinding, buffing or sharpening2%
G01BMeasuring length, thickness or similar linear dimensions2%
PatentTitleYear
10,766,117Retaining ring with shaped surface202010,610,994Polishing system with local area rate control and oscillation mode202010,589,399Textured small pad for chemical mechanical polishing202010,434,623Local area polishing system and polishing pad assemblies for a polishing system201910,256,111Chemical mechanical polishing automated recipe generation201910,252,397Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes20199,937,601Retaining ring with Shaped Surface20189,242,337'Dynamic residue clearing control with in-situ profile control (ISPC)'20169,186,773'Retaining ring with shaped surface'20159,138,860'Closed-loop control for improved polishing pad profiles'20159,017,138'Retaining ring monitoring and control of pressure'20158,758,085'Method for compensation of variability in chemical mechanical polishing consumables'20148,755,927'Feedback for polishing rate correction in chemical mechanical polishing'20148,585,468'Retaining ring with shaped surface'20138,467,896'Feedback for polishing rate correction in chemical mechanical polishing'20138,337,279'Closed-loop control for effective pad conditioning'20128,190,285'Feedback for polishing rate correction in chemical mechanical polishing'20128,066,551'Retaining ring with shaped surface'20117,927,190'Retaining ring with shaped surface'20117,344,434'Retaining ring with shaped surface'20087,115,024'Profile control platen'20066,913,518'Profile control platen'20056,855,043'Carrier head with a modified flexible membrane'20056,855,031'Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer'20056,572,446'Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane'20036,551,176'Pad conditioning disk'20036,220,941'Method of post CMP defect stability improvement'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2020Patents assigned to APPLIED MATERIALS INC (27)· patent assignee history
2001Based in San Francisco, CA, US· patent location history
2003–2018Based in San Jose, CA, US· patent location history
2003–2005Based in Palo Alto, CA, US· patent location history
2011–2015Patents assigned to GARRETSON CHARLES C (7)· patent assignee history
2011–2013Patents assigned to CHEN HUNG CHIH (3)· patent assignee history
2012–2015Patents assigned to DHANDAPANI SIVAKUMAR (5)· patent assignee history
2012–2015Patents assigned to MENK GREGORY E (3)· patent assignee history
2013–2020Based in Sunnyvale, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC272001–2020
GARRETSON CHARLES Cself72011–2015
DHANDAPANI SIVAKUMAR52012–2015
CHEN HUNG CHIH32011–2013
MENK GREGORY E32012–2015
Locations
LocationPatentsSpan
Sunnyvale, California, US122013–2020
San Jose, California, US122003–2018
Palo Alto, California, US22003–2005
San Francisco, California, US12001