Inventor

Robert A. Rita

Inventor

Wappingers Falls, NY, US

Overview

32→

Patents

1984–2009

Patent span

Electricity

Primary field (CPC H)

Patents· 32 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits22%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

Y10TTechnical subjects covered by former us classification18%

C04BLime, magnesia7%

C03CChemical composition of glasses, glazes or vitreous enamels6%

H01GCapacitors6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%

H10DInorganic electric semiconductor devices4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

H01BCables3%

PatentTitleYear

7,608,295'Polyimide compositions and use thereof in ceramic product defect repair'2009 7,387,838'Low loss glass-ceramic materials, method of making same and electronic packages including same'2008 7,294,909'Electronic package repair process'2007 7,186,461'Glass-ceramic materials and electronic packages including same'2007 6,943,108'Interposer capacitor built on silicon wafer and joined to a ceramic substrate'2005 6,916,670'Electronic package repair process'2005 6,823,585'Method of selective plating on a substrate'2004 6,791,133'Interposer capacitor built on silicon wafer and joined to a ceramic substrate'2004 6,713,686'Apparatus and method for repairing electronic packages'2004 6,475,555'Process for screening features on an electronic substrate with a low viscosity paste'2002 6,461,493'Decoupling capacitor method and structure using metal based carrier'2002 6,436,332'Low loss glass ceramic composition with modifiable dielectric constant'2002 6,430,030'High k dielectric material with low k dielectric sheathed signal vias'2002 6,413,339'Low temperature sintering of ferrite materials'2002 6,339,527'Thin film capacitor on ceramic'2002 6,285,080'Planar metallized substrate with embedded camber control material and method thereof'2001 6,254,925'Source metal embedded in an inert material and process thereof'2001 6,231,707'Method of forming a multilayer ceramic substrate with max-punched vias'2001 6,216,324'Method for a thin film multilayer capacitor'2001 6,210,545'Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target'2001 6,200,400'Method for making high k dielectric material with low k dielectric sheathed signal vias'2001 6,178,082'High temperature, conductive thin film diffusion barrier for ceramic/metal systems'2001 6,171,988'Low loss glass ceramic composition with modifiable dielectric constant'2001 6,117,367'Pastes for improved substrate dimensional control'2000 6,072,690'High k dielectric capacitor with low k sheathed signal vias'2000 6,023,407'Structure for a thin film multilayer capacitor'2000 5,948,193'Process for fabricating a multilayer ceramic substrate from thin greensheet'1999 5,655,209'Multilayer ceramic substrates having internal capacitor, and process for producing same'1997 5,489,465'Edge seal technology for low dielectric/porous substrate processing'1996 5,337,475'Process for producing ceramic circuit structures having conductive vias'1994 5,283,104'Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates'1994 4,478,947'Gas panel seal glass'1984

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1984–2009Patents assigned to IBM (30)· patent assignee history

1984Based in Lake Katrine, NY, US· patent location history

1994–2005Based in Wappingers Falls, NY, US· patent location history

2001Based in Wappinger Falls, NY, US· patent location history

2004–2009Based in Manlius, NY, US· patent location history

2007–2008Patents assigned to CAPITAL FORMATION INC (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	30	1984–2009
CAPITAL FORMATION INC	2	2007–2008

Locations

Location	Patents	Span
Wappingers Falls, New York, US	24	1994–2005
Manlius, New York, US	6	2004–2009
Wappinger Falls, New York, US	1	2001
Lake Katrine, New York, US	1	1984