Inventor

Sih-Hao Liao

Inventor

New Taipei, TW

Overview

18→

Patents

2015–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices28%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%

C08LCompositions of macromolecular compounds5%

C09DCoating compositions, e.g. paints, varnishes or lacquers3%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%

B82YSpecific uses or applications of nanostructures2%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

PatentTitleYear

10,867,811Semiconductor device2020 10,854,569Package structure, semiconductor device and method of fabricating the same2020 10,833,053Semiconductor package and method of forming the same2020 10,797,023Integrated fan-out package and method of fabricating an integrated fan-out package2020 10,665,545Semiconductor devices, semiconductor packages and methods of forming the same2020 10,658,287Semiconductor device having a tapered protruding pillar portion2020 10,658,199Semiconductor device and method2020 10,658,208Polyimide composition for package structure, package structure and method of fabricating the same2020 10,607,941Method of forming semiconductor device2020 10,510,704Package structure and method of manufacturing the same2019 10,510,706Package structure and method of fabricating the same2019 10,446,521Integrated fan-out package and method of fabricating an integrated fan-out package2019 10,332,856Package structure and method of fabricating the same2019 10,276,421Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages2019 10,276,543Semicondcutor device package and method of forming semicondcutor device package2019 10,049,889Method of fabricating package structures2018 9,741,586'Method of fabricating package structures'2017 9,105,851'Composite material of hole-blocking polymer and electron-injection/electron-transport conjugated polymer grafted with crown ether into which metal ion is intercalated, and uses thereof in OLED and organic solar cell'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015Patents assigned to CHEN SHOW-AN (1)· patent assignee history

2015Patents assigned to LIAO SIH-HAO (1)· patent assignee history

2015Patents assigned to LU HSIN-HUNG (1)· patent assignee history

2015Patents assigned to Ma yun-sheng (1)· patent assignee history

2015–2017Based in Hsinchu, TW· patent location history

2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history

2018–2020Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	17	2017–2020
CHEN SHOW-AN	1	2015
LIAO SIH-HAOself	1	2015
LU HSIN-HUNG	1	2015
Ma yun-sheng	1	2015

Locations

Location	Patents	Span
New Taipei, TW	16	2018–2020
Hsinchu, TW	2	2015–2017