Inventor
CHARLES LEON ARVIN
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
Y02PClimate change mitigation technologies in the production or processing of goods11%
C02FTreatment of water, waste water, sewage, or sludge6%
H05KPrinted circuits6%
PatentTitleYear
12,183,702Electronic package with varying interconnects202411,756,930High bandwidth module202311,694,992Near tier decoupling capacitors202311,282,773Enlarged conductive pad structures for enhanced chip bond assembly yield202211,239,183Mitigating thermal-mechanical strain and warpage of an organic laminate substrate202211,201,136High bandwidth module202111,180,398Deionized-water cooling for electrical equipment202111,152,282Localized catalyst for enhanced thermal interface material heat transfer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (8)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2021–2024 |