Inventor
Naoto Yoshitaka
Inventor
Koshi, JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H01LSemiconductor devices17%
B23KSoldering or unsoldering10%
Y10TTechnical subjects covered by former us classification10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B05DProcesses for applying fluent materials to surfaces, in general4%
B08BCleaning in general4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
9,960,069Joining device and joining system20189,919,509'Peeling device, peeling system and peeling method'20189,922,859'Joining device and joining system'20189,716,002'Substrate cleaning method'20179,607,869'Bonding system'20179,330,898'Separation system, separation method, program and computer storage medium'20169,165,758'Peeling system, peeling method, and computer storage medium'20159,120,120'Cleaning apparatus and cleaning method, coater/developer and coating and developing method, and computer readable storing medium'20158,851,092'Cleaning apparatus and cleaning method, coater/developer and coating and developing method, and computer readable storing medium'20148,819,923'Joint apparatus'20148,578,953'Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium'20138,088,455'Laser treatment apparatus'20127,919,727'Laser processing apparatus and laser processing method'20117,710,582'Laser processing apparatus and laser processing method for cutting and removing a part of a surface region of a substrate'20107,622,000'Laser processing apparatus and laser processing method'20097,518,087'Laser processing apparatus and laser processing method'20097,473,321'Laser treatment apparatus'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2018Patents assigned to TOKYO ELECTRON LTD (16)· patent assignee history
2009–2010Based in Kikuchi-gun, JP· patent location history
2009–2012Based in Suwa, JP· patent location history
2011–2018Based in Koshi, JP· patent location history
2012–2018Patents assigned to YOSHITAKA NAOTO (7)· patent assignee history
2013–2014Patents assigned to TOKUNAGA YOICHI (2)· patent assignee history
2015–2016Patents assigned to MATSUNAGA MASATAKA (2)· patent assignee history
2016–2018Patents assigned to HIRAKAWA OSAMU (2)· patent assignee history
2016–2017Based in Kumamoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 16 | 2009–2018 |
| YOSHITAKA NAOTOself | 7 | 2012–2018 |
| HIRAKAWA OSAMU | 2 | 2016–2018 |
| MATSUNAGA MASATAKA | 2 | 2015–2016 |
| TOKUNAGA YOICHI | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Koshi, JP | 10 | 2011–2018 |
| Kikuchi-gun, JP | 3 | 2009–2010 |
| Kumamoto, JP | 2 | 2016–2017 |
| Suwa, JP | 2 | 2009–2012 |