Inventor
Takehiko Kai
Inventor
Tokyo, JP
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits15%
H01QAntennas, i.e. radio aerials9%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,868,364Wireless module and method for manufacturing the same202010,756,024Electronic component module and method of manufacturing the same202010,714,822Wireless module and method for manufacturing wireless module202010,665,936Wireless module and method for manufacturing wireless module202010,529,668Method of manufacturing electronic component module202010,490,512Method of making plural electronic component modules20199,807,916'Circuit module and method of producing the same'20179,455,209'Circuit module and production method therefor'20169,456,488'Circuit module and method of producing circuit module'20169,018,039'Circuit module and method of producing circuit module'20158,890,309'Circuit module and method of producing circuit module'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to TAIYO YUDEN KK (11)· patent assignee history
2014–2020Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIYO YUDEN KK | 11 | 2014–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 11 | 2014–2020 |