Inventor
Kao-Ting Lai
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices33%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
A61KPreparations for medical, dental or toiletry purposes7%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry7%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%
C08JWorking-up7%
C08LCompositions of macromolecular compounds7%
PatentTitleYear
10,940,459Molecularly imprinted polymers for sequestering acetate and other molecules202110,770,571FinFET with dummy fins and methods of making the same20209,997,629FinFET with high mobility and strain channel20189,368,628'FinFET with high mobility and strain channel'20168,729,634'FinFET with high mobility and strain channel'20148,404,538'Device with self aligned stressor and method of making same'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2016Patents assigned to LAI KAO-TING (3)· patent assignee history
2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2013–2016Patents assigned to WU CHI-HSI (3)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2014–2016Patents assigned to LI HOU-JU (2)· patent assignee history
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Hong Kong, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAI KAO-TINGself | 3 | 2013–2016 |
| TAIWAN SEMICONDUCTOR MFG | 3 | 2013–2016 |
| WU CHI-HSI | 3 | 2013–2016 |
| LI HOU-JU | 2 | 2014–2016 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 2 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2013–2020 |
| Hong Kong, CN | 1 | 2021 |