Inventor
Sangwon Oh
Inventor
Daejeon, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering19%
B82YSpecific uses or applications of nanostructures19%
H05KPrinted circuits19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
Y10TTechnical subjects covered by former us classification19%
H01LSemiconductor devices5%
PatentTitleYear
9,462,736'Composition and methods of forming solder bump and flip chip using the same'20169,155,236'Composition and methods of forming solder bump and flip chip using the same'20158,802,760'Composition and methods of forming solder bump and flip chip using the same'20148,420,722'Composition and methods of forming solder bump and flip chip using the same'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2015Patents assigned to KOREA ELECTRONICS TELECOMM (3)· patent assignee history
2013Patents assigned to EOM YONG SUNG (1)· patent assignee history
2013Patents assigned to JANG KEONSOO (1)· patent assignee history
2013Patents assigned to MOON JONG TAE (1)· patent assignee history
2013–2016Based in Daejeon, KR· patent location history
2016Patents assigned to ELECTRONICS & TELECOMMUNICATIONS RES INST (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KOREA ELECTRONICS TELECOMM | 3 | 2013–2015 |
| ELECTRONICS & TELECOMMUNICATIONS RES INST | 1 | 2016 |
| EOM YONG SUNG | 1 | 2013 |
| JANG KEONSOO | 1 | 2013 |
| MOON JONG TAE | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Daejeon, KR | 4 | 2013–2016 |