Inventor
ZHIWEI GONG
Inventor
US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices28%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H01QAntennas, i.e. radio aerials6%
H04NPictorial communication, e.g. television4%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them2%
G06FElectric digital data processing2%
H03FAmplifiers2%
H04MTelephonic communication2%
PatentTitleYear
12,588,557Multichip packages with 3D integration202612,557,221Molded packages with through-mold interconnects202612,538,844Double-sided multichip packages202612,406,896Semiconductor device package having thermal dissipation feature and method therefor202512,387,985Semiconductor device with cavity carrier and method therefor202512,184,237Surface-mount amplifier devices202412,125,716Semiconductor device packaging warpage control202412,040,291Radio frequency packages containing multilevel power substrates and associated fabrication methods202411,967,507Tie bar removal for semiconductor device packaging202411,935,809Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements202411,847,469Intelligent device and method for controlling boot screen of the intelligent device202311,817,366Semiconductor device package having thermal dissipation feature and method therefor202311,791,283Semiconductor device packaging warpage control202311,728,285Semiconductor device packaging warpage control202311,557,525Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements202311,404,288Semiconductor device packaging warpage control202211,335,652Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide202211,297,246Photography control method, device, non-transitory storage medium and system of intelligent photography system202211,245,854Intelligent photography system202211,222,790Tie bar removal for semiconductor device packaging2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to NXP USA INC (16)· patent assignee history
2022Patents assigned to WUHAN LIANYI HELI TECH CO LTD (2)· patent assignee history
2022–2026Based in US· patent location history
2022–2023Based in CN· patent location history
2023Patents assigned to AMLOGIC SHANGHAI CO LTD (1)· patent assignee history
2025Patents assigned to NXP BV (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP USA INC | 16 | 2022–2026 |
| WUHAN LIANYI HELI TECH CO LTD | 2 | 2022 |
| AMLOGIC SHANGHAI CO LTD | 1 | 2023 |
| NXP BV | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 17 | 2022–2026 |
| CN | 3 | 2022–2023 |