Inventor

Hengjie Lai

Inventor

Shanghai, CN

Overview

1→

Patents

2019

Patent span

Performing operations

Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Bprimary

B29BPreparation or pretreatment of the material to be shaped14%

B29CShaping or joining of plastics14%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form14%

C08JWorking-up14%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%

C09DCoating compositions, e.g. paints, varnishes or lacquers14%

PatentTitleYear

10,227,465Conductive multilayer sheet for thermal forming applications2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to SABIC GLOBAL TECHNOLOGIES BV (1)· patent assignee history

2019Based in Shanghai, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SABIC GLOBAL TECHNOLOGIES BV	1	2019

Locations

Location	Patents	Span
Shanghai, CN	1	2019