Inventor
Sung Keun Park
Inventor
Kyungki-do, KR
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H01LSemiconductor devices7%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
A41HAppliances or methods for making clothes, e.g. for dress-making or for tailoring, not otherwise provided for4%
A45DHairdressing or shaving equipment4%
B01FMixing, e.g. dissolving, emulsifying or dispersing4%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
C08LCompositions of macromolecular compounds4%
PatentTitleYear
10,847,474Semiconductor package and electromagnetic interference shielding structure for the same202010,790,255Fan-out semiconductor package202010,683,391Thermoplastic elastomer resin composition for moisture-permeable waterproof film, film and fabric using same202010,643,857Method of generating layout and method of manufacturing semiconductor devices using same202010,366,513Apparatus and method for formulation and dispensing of visually customized cosmetics201910,216,082Layout design system, system and method for fabricating mask pattern using the same20199,858,685'Apparatus and method for formulation and dispensing of visually customized cosmetics'20189,422,644'Thermoplastic poly-ether-ester elastomer resin composition and elastic monofilaments prepared therefrom'20169,107,313'Method of manufacturing a hybrid heat-radiating substrate'2015D0726650'Portable charger'20158,941,220'Power module package and system module having the same'20158,792,239'Power module package and method for manufacturing the same'20148,686,295'Heat-dissipating substrate and fabricating method thereof'20148,603,842'Method of manufacturing package substrate for optical element'20138,558,359'Semiconductor package having lead frames'20138,502,374'Power module package and method for manufacturing the same'20138,315,056'Heat-radiating substrate and method of manufacturing the same'20127,412,176'Method of processing an error of an image forming apparatus'20085,768,135'Custom apparel manufacturing apparatus and method'19985,548,519'Custom apparel manufacturing apparatus and method'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1998Based in Jamaica Plain, MA, US· patent location history
2008–2020Based in Suwon-si, KR· patent location history
2012–2019Patents assigned to PARK SUNG KEUN (9)· patent assignee history
2012–2015Patents assigned to SAMSUNG ELECTRO MECH (8)· patent assignee history
2012–2015Patents assigned to CHOI SEOG MOON (5)· patent assignee history
2012–2014Patents assigned to LIM CHANG HYUN (5)· patent assignee history
2012–2015Based in Kyungki-do, KR· patent location history
2013–2015Patents assigned to LEE YOUNG KI (6)· patent assignee history
2018–2019Based in Brookline, MA, US· patent location history
2019–2020Based in Goyang-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PARK SUNG KEUNself | 9 | 2012–2019 |
| SAMSUNG ELECTRO MECH | 8 | 2012–2015 |
| LEE YOUNG KI | 6 | 2013–2015 |
| CHOI SEOG MOON | 5 | 2012–2015 |
| LIM CHANG HYUN | 5 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyungki-do, KR | 8 | 2012–2015 |
| Suwon-si, KR | 3 | 2008–2020 |
| Goyang-si, KR | 2 | 2019–2020 |
| Brookline, Massachusetts, US | 2 | 2018–2019 |
| Jamaica Plain, Massachusetts, US | 2 | 1996–1998 |