Inventor
Yue Li
Inventor
San Diego, CA, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H01LSemiconductor devices14%
H05KPrinted circuits9%
H04LTransmission of digital information, e.g. telegraphic communication7%
G11CStatic stores5%
H01RElectrically-conductive connections5%
H03KPulse technique5%
H01FMagnets2%
H01GCapacitors2%
PatentTitleYear
11,115,355Information display method, apparatus, and devices202111,102,134Method and apparatus for determining contention window size in clear channel assessment202110,992,090Cable connector assembly having two plugs for providing a secure connection202110,846,007Shuffle manager in a distributed memory object architecture202010,802,972Distributed memory object apparatus and method enabling memory-speed data access for memory and storage semantics202010,802,748Cost-effective deployments of a PMEM-based DMO system202010,803,006Persistent memory key-value store in a distributed memory architecture202010,372,594Method and device for retrieving test case based on code coverage201910,321,575Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components201910,231,324Staggered power structure in a power distribution network (PDN)201910,170,232Toroid inductor with reduced electromagnetic field leakage20199,654,090'Systems and methods for clock distribution in a die-to-die interface'20179,350,339'Systems and methods for clock distribution in a die-to-die interface'20169,263,186'DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor'20169,041,176'Hybrid semiconductor module structure'20158,742,256'Electronic device enclosure'20148,721,357'Electronic device connector'20148,012,874'Semiconductor chip substrate with multi-capacitor footprint'20117,694,116'Test method for verifying installation validity of a PCI device on a electronic device'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2014Patents assigned to HON HAI PREC IND CO LTD (3)· patent assignee history
2014Patents assigned to HONGFUJIN PREC IND WUHAN (2)· patent assignee history
2014Patents assigned to LI YUE-YONG (2)· patent assignee history
2014Based in Wuhan, CN· patent location history
2015–2019Patents assigned to QUALCOMM INC (7)· patent assignee history
2015–2019Based in San Diego, CA, US· patent location history
2020Patents assigned to MEMVERGE INC (4)· patent assignee history
2020Based in Fremont, CA, US· patent location history
2021Based in Hangzhou, CN· patent location history
2021Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 7 | 2015–2019 |
| MEMVERGE INC | 4 | 2020 |
| HON HAI PREC IND CO LTD | 3 | 2010–2014 |
| HONGFUJIN PREC IND WUHAN | 2 | 2014 |
| LI YUE-YONGself | 2 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 6 | 2015–2019 |
| Fremont, California, US | 3 | 2020 |
| Wuhan, CN | 2 | 2014 |
| Hangzhou, CN | 1 | 2021 |
| Beijing, CN | 1 | 2021 |