Inventor
Darrell D. Truhitte
Inventor
Phoenix, AZ, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers4%
LOC134%
Y10TTechnical subjects covered by former us classification4%
H05KPrinted circuits2%
PatentTitleYear
11,049,843Semiconductor packages202111,037,903Plasma etch singulated semiconductor packages and related methods202110,770,332Wafer level flat no-lead semiconductor packages and methods of manufacture202010,770,333Wafer level flat no-lead semiconductor packages and methods of manufacture202010,756,006Leadless semiconductor packages, leadframes therefor, and methods of making202010,707,111Wafer level flat no-lead semiconductor packages and methods of manufacture202010,529,632Damaging components with defective electrical couplings202010,399,756Carrier tape with standoff units201910,304,798Semiconductor packages with leadframes and related methods201910,269,609Wafer level flat no-lead semiconductor packages and methods of manufacture201910,199,311Leadless semiconductor packages, leadframes therefor, and methods of making201910,163,766Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks201810,103,072Damaging components with defective electrical couplings201810,093,468Carrier tape with standoff units20189,899,349'Semiconductor packages and related methods'20189,892,952'Wafer level flat no-lead semiconductor packages and methods of manufacture'20189,659,876'Wafer-scale marking systems and related methods'20179,559,007'Plasma etch singulated semiconductor packages and related methods'20178,987,054'Semiconductor devices and methods of making the same'2015D0510728'Semiconductor device package'2005D0504874'Semiconductor device package'20056,852,574'Method of forming a leadframe for a semiconductor package'20055,585,281'Process and apparatus for forming and testing semiconductor package leads'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Patents assigned to MOTOROLA INC (1)· patent assignee history
1996–2021Based in Phoenix, AZ, US· patent location history
2005–2020Patents assigned to SEMICONDUCTOR COMPONENTS IND (5)· patent assignee history
2015Patents assigned to TRUHITTE DARRELL (1)· patent assignee history
2017–2021Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (17)· patent assignee history
2017Patents assigned to SEMICONDUDTOR COMPONENTS IND LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMICONDUCTOR COMPONENTS IND LLC | 17 | 2017–2021 |
| SEMICONDUCTOR COMPONENTS IND | 5 | 2005–2020 |
| MOTOROLA INC | 1 | 1996 |
| SEMICONDUDTOR COMPONENTS IND LLC | 1 | 2017 |
| TRUHITTE DARRELLself | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 23 | 1996–2021 |