Inventor
Fu-Tang Huang
Inventor
Taichung, TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H05KPrinted circuits7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
H01RElectrically-conductive connections2%
PatentTitleYear
10,872,870Fabrication method of semiconductor structure202010,629,572Electronic package and method for fabricating the same202010,522,453Substrate structure with filling material formed in concave portion201910,510,720Electronic package and method for fabricating the same201910,361,150Substrate construction and electronic package including the same201910,325,872Fabrication method of semiconductor structure201910,199,331Fabrication method of electronic package having embedded package block201910,192,834Semiconductor package and fabrication method thereof20199,907,186'Electronic package structure and method for fabricating the same'20189,900,996'Package substrate and structure'20189,842,771'Semiconductor device and fabrication method thereof and semiconductor structure'20179,812,340'Method of fabricating semiconductor package having semiconductor element'20179,735,124'Semiconductor structure and method of fabricating the same'20179,607,963'Semiconductor device and fabrication method thereof'20179,524,944'Method for fabricating package structure'20169,520,351'Packaging substrate and package structure'20169,362,245'Package structure and fabrication method thereof'20169,356,008'Semiconductor package and fabrication method thereof'20169,324,585'Semiconductor package and method of fabricating the same'20168,162,672'High power receptacle connector'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2016Patents assigned to HUANG FU-TANG (2)· patent assignee history
2012Patents assigned to JYE TAI PREC IND CO LTD (1)· patent assignee history
2012Based in New Taipei, TW· patent location history
2016–2020Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (19)· patent assignee history
2016Patents assigned to LAI YA-YI (1)· patent assignee history
2016Patents assigned to LI HSIU-JUNG (1)· patent assignee history
2016–2020Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 19 | 2016–2020 |
| HUANG FU-TANGself | 2 | 2012–2016 |
| JYE TAI PREC IND CO LTD | 1 | 2012 |
| LAI YA-YI | 1 | 2016 |
| LI HSIU-JUNG | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 19 | 2016–2020 |
| New Taipei, TW | 1 | 2012 |