Inventor
I-HSUAN PENG
Inventor
TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H03MCoding6%
H05KPrinted circuits6%
H10DInorganic electric semiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
12,525,549Semiconductor package structure202612,444,715Semiconductor package structure202512,388,026Electronic package with rotated semiconductor die202512,183,723Semiconductor package with dummy MIM capacitor die202412,142,598Semiconductor package structure having an annular frame with truncated corners202412,021,031Semiconductor package structure202411,948,895Semiconductor package structure202411,862,578Semiconductor package structure202411,854,930Semiconductor chip package and fabrication method thereof202311,830,851Semiconductor package structure202311,830,820Electronic package with rotated semiconductor die202311,728,292Semiconductor package assembly having a conductive electromagnetic shield layer202311,728,232Semiconductor package having a stiffener ring202311,688,655Semiconductor package including lid structure with opening and recess202311,670,596Semiconductor package structure202311,646,295Semiconductor package structure having an annular frame with truncated corners202311,508,707Semiconductor package with dummy MIM capacitor die202211,469,152Semiconductor chip package and fabrication method thereof202211,410,936Semiconductor package structure202211,302,592Semiconductor package having a stiffener ring202211,264,337Semiconductor package structure202211,222,850Electronic package with rotated semiconductor die2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to MEDIATEK INC (22)· patent assignee history
2022–2026Based in TW· patent location history
2023Patents assigned to MEDIA TEK INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEDIATEK INC | 22 | 2022–2026 |
| MEDIA TEK INC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 22 | 2022–2026 |