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Inventor

Hideyasu Machii

Inventor
Tokyo, JP

Overview

2→
Patents
2013–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering50%
G05BControl or regulating systems in general25%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light25%
PatentTitleYear
10,965,089Laser device, laser machining apparatus, and method for controlling output of laser device20218,536,487'Arc welding method'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013Patents assigned to ADACHI HIROTAKA (1)· patent assignee history
2013Patents assigned to KATADA KANJI (1)· patent assignee history
2013Patents assigned to MACHII HIDEYASU (1)· patent assignee history
2013Patents assigned to NISHIKAWA SEIGO (1)· patent assignee history
2013Based in Ebina, JP· patent location history
2021Patents assigned to MITSUBISHI ELECTRIC CORP (1)· patent assignee history
2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADACHI HIROTAKA12013
KATADA KANJI12013
MACHII HIDEYASUself12013
MITSUBISHI ELECTRIC CORP12021
NISHIKAWA SEIGO12013
Locations
LocationPatentsSpan
Tokyo, JP12021
Ebina, JP12013