LexDanaLexDanabeta
Inventor

CHIEN-PIN CHAN

Inventor
TW

Overview

4→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
12,431,365Bump structure and method of making the same202512,033,870Bump structure and method of making the same202411,527,504Conductive external connector structure and method of forming202211,417,539Bump structure and method of making the same2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2022–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD42022–2025
Locations
LocationPatentsSpan
TW42022–2025