Inventor

Chia-Wei Liu

Inventor

Cupertino, CA, US

Overview

39→

Patents

2000–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 39 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices19%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

H04BTransmission8%

H04LTransmission of digital information, e.g. telegraphic communication8%

H04WWireless communication networks8%

H10DInorganic electric semiconductor devices8%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%

H01QAntennas, i.e. radio aerials6%

H05KPrinted circuits2%

PatentTitleYear

10,818,556Method for forming a semiconductor structure2020 10,819,375Client wireless device that merges functions of upper MAC layer to support WLAN modules operating simultaneously in different wireless bands2020 10,684,067Method for assembling camera assembly2020 10,679,889Method for manufacturing semiconductor structure2020 10,553,489Partitioned wafer and semiconductor die2020 10,453,881Infrared image sensor component2019 10,438,838Semiconductor structure and related method2019 D0844126Dehumidifier2019 10,236,585Isolated multiband tubular dipole2019 10,236,578Antenna structures and associated methods for construction and use2019 10,050,103Method of forming semiconductor structures including metal insulator metal capacitor2018 9,985,662Systems and methods for improving WLAN range2018 9,984,971Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers2018 9,948,326Systems and methods for implementing a wireless device that supports WLAN modules operating simultaneously in different wireless bands2018 9,923,581'Front-end module and antenna design for a wireless device simultaneously using WLAN modules operating in different wireless bands'2018 9,905,466'Wafer partitioning method and device formed'2018 9,871,067'Infrared image sensor component'2018 9,699,897'Pad structure'2017 9,691,807'CMOS image sensor structure'2017 9,666,660'Semiconductor structures including metal insulator metal capacitor'2017 9,627,249'Semiconductor structure and method for manufacturing the same'2017 9,627,767'High efficiency antenna'2017 9,620,551'Mechanisms for forming backside illuminated image sensor device structure'2017 9,590,661'Systems and methods for improving WLAN range'2017 9,530,690'Metal pad structure over TSV to reduce shorting of upper metal layer'2016 9,524,997'Semiconductor device having seal ring'2016 9,516,540'Systems and methods for implementing a wireless device that supports WLAN modules operating simultaneously in different wireless bands'2016 9,439,099'Systems and methods for simultaneously using multiple WLAN modules operating in different wireless bands'2016 9,425,516'Compact dual band GNSS antenna design'2016 9,402,199'Systems and methods for wireless load balancing and channel selection for a wireless device using WLAN modules operating simultaneously in different wireless bands'2016 9,287,303'CMOS image sensor structure'2016 9,281,336'Mechanisms for forming backside illuminated image sensor device structure'2016 9,190,729'High efficiency antenna'2015 9,177,914'Metal pad structure over TSV to reduce shorting of upper metal layer'2015 9,048,545'Enhanced high efficiency 3G/4G/LTE antennas, devices and associated processes'2015 8,152,143'Structure of cooling tower'2012 7,498,653'Semiconductor structure for isolating integrated circuits of various operating voltages'2009 7,301,185'High-voltage transistor device having an interlayer dielectric etch stop layer for preventing leakage and improving breakdown voltage'2007 6,060,954'Oscillator device having inductor formed inside multi-layer circuit board'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2015Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history

2007–2016Based in Huatan Township, TW· patent location history

2012–2015Patents assigned to LIU CHIA-WEI (2)· patent assignee history

2015–2020Patents assigned to NETGEAR INC (13)· patent assignee history

2015–2020Based in Cupertino, CA, US· patent location history

2015–2019Based in Fremont, CA, US· patent location history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history

2016–2020Based in Zhubei City, TW· patent location history

2016–2020Based in Hsinchu County, TW· patent location history

2019–2020Patents assigned to HON HAI PREC IND CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	17	2016–2020
NETGEAR INC	13	2015–2020
TAIWAN SEMICONDUCTOR MFG	3	2007–2015
HON HAI PREC IND CO LTD	2	2019–2020
LIU CHIA-WEIself	2	2012–2015

Locations

Location	Patents	Span
Cupertino, California, US	9	2015–2020
Zhubei City, TW	8	2016–2020
Hsinchu County, TW	7	2016–2020
Fremont, California, US	5	2015–2019
Huatan Township, TW	3	2007–2016