Inventor
Guy R. Wagner
Inventor
Loveland, CO, US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
G06FElectric digital data processing8%
LOC236%
F04DNon-positive-displacement pumps5%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
G11CStatic stores5%
H03MCoding5%
H05KPrinted circuits5%
A61KPreparations for medical, dental or toiletry purposes3%
A63BApparatus for physical training, gymnastics, swimming, climbing, or fencing3%
PatentTitleYear
9,720,515'Method and apparatus for a gesture controlled interface for wearable devices'20179,612,661'Closed loop feedback interface for wearable devices'20179,081,717'Memory quality monitor based compensation method and apparatus'20158,862,969'Memory quality monitor based compensation method and apparatus'20148,801,529'Advanced golf monitoring system, method and components'20148,499,227'Memory quality monitor based compensation method and apparatus'20138,376,681'Charging device for a shaft furnace'20138,257,189'Advanced golf monitoring system, method and components'20126,986,384'Cooling apparatus for dissipating heat from a heat source'20066,874,565'Cooling apparatus'20056,769,175'Heat sink device manufacture'20046,763,881'Thermally matched gradient heat sink'2004D0489804'Cooling device'2004D0489441'Cooling device'20046,698,499'Cooling device and method'20046,691,770'Cooling apparatus'20046,681,842'Cooling apparatus'20046,640,882'Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled'2003D0476072'Cooling device'20036,561,261'Cooling apparatus for electronic devices'20036,535,389'Heat sink mounting assembly'20036,459,578'Chassis having reduced acoustic noise and electromagnetic emissions and method of cooling components within a chassis'20026,401,808'Cooling apparatus for electronic devices and method'2002D0455407'Cooling device'2002D0454947'Cooling device'20026,360,816'Cooling apparatus for electronic devices'20026,176,299'Cooling apparatus for electronic devices'20016,157,539'Cooling apparatus for electronic devices'20006,152,214'Cooling device and method'20006,134,108'Apparatus and method for air-cooling an electronic assembly'2000D0428857'Cooling device'20005,975,194'Fan assisted heat sink device'19995,926,386'Configuration based cooling fan speed control'19995,785,116'Fan assisted heat sink device'19985,740,013'Electronic device enclosure having electromagnetic energy containment and heat removal characteristics'19984,002,381'Card mounting assembly'1977Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1977Based in Arvada, CO, US· patent location history
1998–2000Patents assigned to HEWLETT PACKARD CO (5)· patent assignee history
1998–2015Based in Loveland, CO, US· patent location history
2000–2006Patents assigned to AGILENT TECHNOLOGIES INC (20)· patent assignee history
2012–2014Patents assigned to KOUDELE LARRY J (3)· patent assignee history
2012–2014Patents assigned to WAGNER GUY R (3)· patent assignee history
2013–2015Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2013Based in Hovelange, LU· patent location history
2017Based in Kiryat Tivon, IL· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AGILENT TECHNOLOGIES INC | 20 | 2000–2006 |
| HEWLETT PACKARD CO | 5 | 1998–2000 |
| KOUDELE LARRY J | 3 | 2012–2014 |
| MICRON TECHNOLOGY INC | 3 | 2013–2015 |
| WAGNER GUY Rself | 3 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Loveland, CO, US | 32 | 1998–2015 |
| Kiryat Tivon, IL | 2 | 2017 |
| Hovelange, LU | 1 | 2013 |
| Arvada, CO, US | 1 | 1977 |