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Inventor

HIROAKI FUJIBAYASHI

Inventor
JP

Overview

3→
Patents
2024–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
C30BSingle-crystal growth13%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices13%
H01LSemiconductor devices13%
H10DInorganic electric semiconductor devices13%
PatentTitleYear
12,252,791Apparatus for manufacturing semiconductor device202512,188,151Silicon carbide wafer and method for manufacturing the same202511,879,171Semiconductor manufacturing device2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024–2025Patents assigned to DENSO CORP (3)· patent assignee history
2024–2025Based in JP· patent location history
2025Patents assigned to MIRISE Technologies Corporation (1)· patent assignee history
2025Patents assigned to TOYOTA MOTOR CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DENSO CORP32024–2025
MIRISE Technologies Corporation12025
TOYOTA MOTOR CO LTD12025
Locations
LocationPatentsSpan
JP32024–2025