Inventor
Prateek Dujari
Inventor
Portland, OR, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H05KPrinted circuits15%
F01KSteam engine plants6%
F03GSpring, weight, inertia or like motors6%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application6%
H10DInorganic electric semiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
C21DModifying the physical structure of ferrous metals3%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys3%
PatentTitleYear
7,057,114'Circuit board with added impedance'20066,913,999'Semiconductor device with components embedded in backside diamond layer'20056,877,318'Electrical energy-generating heat sink system and method of using same to recharge an energy storage device'20056,797,085'Metallurgically enhanced heat sink'20046,774,310'Surface mount connector lead'20046,775,122'Circuit board with added impedance'20046,752,204'Iodine-containing thermal interface material'20046,649,937'Semiconductor device with components embedded in backside diamond layer'20036,627,978'Chip package enabling increased input/output density'20036,624,643'Apparatus and method to read output information from a backside of a silicon device'20036,574,963'Electrical energy-generating heat sink system and method of using same to recharge an energy storage device'20036,550,531'Vapor chamber active heat sink'20036,521,516'Process for local on-chip cooling of semiconductor devices using buried microchannels'20036,486,589'Circuit card assembly having controlled vibrational properties'20026,359,372'Circuit card assembly having controlled expansion properties'20026,327,145'Heat sink with integrated fluid circulation pump'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2006Patents assigned to INTEL CORP (16)· patent assignee history
2001–2006Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 16 | 2001–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Portland, OR, US | 16 | 2001–2006 |